Quectel HCM111Z BLE 5.3 Module Compact LCC Package - SATRON electronics
Quectel HCM111Z
Bluetooth 5.3 Module
  • LCC form factor
  • 15.0 mm × 12.0 mm × 2.25 mm
  • 0.62 g
  • Operating temperature of -40°C to +85°C

HCM111Z is a high-performance MCU Bluetooth module launched by Quectel. It boasts a Cortex-M3 processor with a frequency of up to 48 MHz and supports BLE 5.3. The module features built-in 48 KB SRAM and 512 KB flash, ensuring efficient performance. HCM111Z comes in an LCC form factor with an ultra-compact size of 15.0 mm × 12.0 mm × 2.25 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

HCM111Z supports up to 13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S* functions in QuecOpen® solution, and Bluetooth low power mode, which provides flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios. The built-in audio codec of HCM111Z is optional and enables microphone pickup and audio playback, which is suitable for smart devices such as smart voice remote controls, smart toy cars, sports health and home appliances.

The multi-connection capability of the module supports dozens of devices to form a communication network, which can be applied in micro-inverters, energy storage, charging piles, etc. In addition, HCM111Z is also widely used in fields such as meters and sensors.

Key Benefits

  • BLE 5.3
  • 48 KB SRAM and 512 KB flash
  • Built-in Codec (Optional)
  • Multi-link network
  • 4th RF coaxial connector, external antenna pin, PCB antenna (Optional)
  • 13 GPIOs for UART, SWD, SPI, I2C, ADC, PWM and I2S functions in QuecOpen solution
BLE 5.3 HCM111Z
Bluetooth Protocol BLE 5.3
Encryption Mode TRNG, AES128 ECB
Operating Mode BLE (Bluetooth Low Energy)
Kernel ARM Cortex-M3 (up to 48 MHz)
SRAM 48 KB
Flash 512 KB
Dimensions 15.0 mm × 12.0 mm × 2.25 mm
Weight Approx. 0.62 g
Temperature Range
Operating Temperature Range -40 °C to +85 °C
Storage Temperature Range -45 °C to +95 °C
Certifications
Regulatory Europe: CE
America: FCC
Canada: IC
China: SRRC
South Korea: KC
Australia/ New Zealand: RCM
Japan: TELEC
Others Bluetooth
Interfaces
Antenna Interface × 1 (4th generation RF coaxial connector, pin antenna interface, PCB antenna) (Optional)
Other Interfaces① UART/ SWD/ I2C/ ADC/ PWM/ SPI, etc.
Electrical Features
Power Supply Voltage 2.4–4.3 V, typ. 3.3 V
RF Performance
BLE 1 Mbps Receiver Sensitivity -95 dBm ±2 dB
BLE 1 Mbps Transmit Power ≤ 10 dBm
Ordering Code Audio Codec Flash Operating Temperature Range
HCM111ZAAMD-0L Supported 512 KB -40 °C to +85 °C
HCM111ZAAMD-0P Supported 512 KB -40 °C to +85 °C
HCM111ZAAMD-4X Supported 512 KB -40 °C to +85 °C
HCM111ZABMD-0P - 512 KB -40 °C to +85 °C
HCM111ZABMD-4X - 512 KB -40 °C to +85 °C
HCM111ZABMD-0L - 512 KB -40 °C to +85 °C
Antenna Pin antenna interface
Development Board & Antenna (Only for Debugging) HCM111ZAATB-0P
Antenna PCB antenna
Development Board & Antenna (Only for Debugging) HCM111ZAATB-0P
Antenna 4th generation RF coaxial connector
Development Board & Antenna (Only for Debugging) HCM111ZAATB-4X
Antenna: YF0029CA
Antenna PCB antenna
Development Board & Antenna (Only for Debugging) HCM111ZABTB-0P
Antenna 4th generation RF coaxial connector
Development Board & Antenna (Only for Debugging) HCM111ZABTB-0P
Antenna Pin antenna interface
Development Board & Antenna (Only for Debugging) -

NOTE:
①: See hardware design manual for details of the module interfaces.

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