Quectel HCM010S BLE 5.4 Module Compact LCC + DIP Package - SATRON electronics
Quectel HCM010S
Bluetooth 5.4 Module
  • BLE 5.4
  • 64KB SRAM and 768KB flash
  • Bluetooth mesh networking
  • 20 GPIOs for I2C, UART, SPI, I2S functions in QuecOpen®solution
  • Operating temperature range: -40°C to +105°C
  • PCB antenna
  • LCC + DIP form factor
  • 20.0mm × 15.6mm × 2.4mm
  • 1.14 g

HCM010S is a high-performance MCU Bluetooth module launched by Quectel. It boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. HCM010S is in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

HCM010S supports up to 20 GPIOs for UART, SPI, I2C and other functions in QuecOpen® solution, features superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.

HCM010S supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.

Key Benefits

  • BLE 5.4
  • 64KB SRAM and 768KB flash
  • Bluetooth mesh networking
  • 20 GPIOs for I2C, UART, SPI, I2S functions in QuecOpen®solution
  • Operating temperature range: -40°C to +105°C
  • PCB antenna
BLE 5.4 HCM010S
Bluetooth Protocol BLE 5.4
Encryption Mode AES128/ 256, SHA-1, SHA-2 (up to 256 bits), ECC (up to 256 bits), ECDSA (up to 256 bits), ECDH, J-Pak, TRNG, secure boot
Operating Mode BLE (Bluetooth Low Energy)
Bluetooth Antenna PCB antenna
Kernel ARM Cortex-M33 (up to 80 MHz)
SRAM 64 KB
Flash 768 KB
Dimensions 20.0 mm × 15.6 mm × 2.35 mm
Weight Approx. 1.14 g
Temperature Range
Operating Temperature Range -40 °C to +105 °C
Storage Temperature Range -45 °C to +115 °C
Certifications
Regulatory Europe: CE
America: FCC
Canada: IC
China: SRRC
Australia/ New Zealand: RCM
Interfaces
Interfaces① I2C/ UART/ SPI/ I2S, etc.
Electrical Features
Power Supply Voltage 1.71–3.8 V, Typ. 3.3 V
RF Performance
BLE Receiver Sensitivity Transmit Power
1 Mbps -97.5 dBm ±2 dB ≤ 20 dBm
2 Mbps -94.4 dBm ±2 dB ≤ 20 dBm
Ordering Code Flash Transmit Power Operating Temperature Range
HCM010SAAMD-0P 768 KB ≤ 20 dBm -40 °C to +105 °C
HCM010SABMD-0P 768 KB ≤ 10 dBm -40 °C to +105 °C

NOTE:
①: See hardware design manual for details of the module interfaces.

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