Quectel FLM263D

FLM263D is a cutting-edge MCU Wi-Fi 6 and Bluetooth module launched by Quectel. It has a built-in 32-bit RISC-V processor with a frequency of up to 320 MHz and supports IEEE 802.11b/g/n/ax protocol and BLE 5.2. The module features built-in 512 KB SRAM and 4MB flash, complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, integrates the Mbed TLS encryption library, and supports the Secure Boot security startup mechanism.

FLM263D is in an LCC form factor with an ultra-compact size of 17.3 mm × 15.0 mm × 2.8 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

The module supports ADC and PWM functions in QuecOpen® solution, and many low power consumption modes and
keep-alive mechanism, which provide flexibility and versatility for a range of applications, especially in smart homes,
industrial IoT, consumer electronics and other application scenarios to meet various product needs. It is especially
suitable for small-sized, high-temperature IoT devices, such as light bulbs.

FLM263D integrates the ACK SDK for Matter solution, which enables terminal products to quickly and efficiently
access the Amazon Alexa platform and can be interconnected with other smart devices that support the Matter
protocol- learn more here.

Key features

• Wi-Fi 6 module, 2.4GHz, single band (2.4 GHz)
• BLE 5.2 and Bluetooth-assisted Wi-Fi provisioning
• PCB antenna or 1st generation RF coaxial connector (Optional)
• Large memory – 512KB SRAM and 4MB flash
• Wide operating temperature range: -40°C to +105°C
• High stability, high reliability and full compatibility