FGS060N is a high-performance Wi-Fi 6, Bluetooth 5.2 and 802.15.4 module in LGA package launched by Quectel. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 11 rates in an 80 MHz bandwidth with 1024QAM supported. The module is designed with a reliable SDIO 3.0 interface to provide WLAN capability.
With an ultra-compact size of 14.0 mm × 13.0 mm × 2.0 mm, FGS060N optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount Technology (SMT) makes FGS060N an ideal solution for durable and rugged designs. Its low profile and small LGA package ensure easy embedding into size-constrained applications and provide reliable connectivity. The advanced package,integrated shielding cover and the laser-engraved label with improved heat dissipation and indelible markings allow for large-scale automated manufacturing, effectively optimizing production costs and efficiency. Additionally, its compact size and wide operating temperature range, make FGS060N suitable for a variety of smart home and industrial applications.
Key features
- 2.4 GHz/ 5 GHz, Bluetooth 5.4
- IEEE 802.15.4 (Thread, Zigbee)
- SDIO 3.0 interface that supports higher data transmission rate and enables lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: -40°C to +85°C
