FGA66X is a high-performance Wi-Fi 6, BLE 5.4 and 802.15.4 module in LGA package launched by Quectel. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 9 rates in an 20 MHz bandwidth with 256QAM supported. The module is designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability.
With an ultra-compact size of 23.0mm × 14.0mm × 2.2mm, FGA66X optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes FGA66X an ideal solution for durable and rugged designs. The low profile and small size of LGA package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, FGA66X is suitable for a variety of smart home and industrial applications.
Key features
- 2.4GHz/5GHz Wi-Fi bands, BLE 5.4
- IEEE 802.15.4 (Thread, Zigbee)
- SDIO 3.0/USB 2.0 interface that support higher data transmission rate and enable lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: -40°C to +85°C
- 4th generation RF coaxial connector, PCB antenna (optional)
