FCS960K is a high-performance Wi-Fi 6 and Bluetooth 5.4 LCC package module launched by Quectel, which can be used for WLAN and Bluetooth connections. The module complies with IEEE 802.11a/b/g/n/ac/ax protocol, supports up to 11ax MCS 11 rate at 80 MHz channel, and the transmission rate can reach 600.5 Mbps. FCS960K adopts reliable SDIO 3.0 interface to support WLAN high-rate transmissions.
With an ultra-compact size of 12.0 mm × 12.0 mm × 2.0 mm, FCS960K optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes FCS960K an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that FCS960K can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, FCS960K can meet various needs of commercial and industrial applications.
Key features
- 2.4GHz/5GHz Wi-Fi band and Bluetooth 5.4
- Wi-Fi/Bluetooth antenna 1 × 1
- SDIO 3.0 interface that supports higher data transmission rate and enables lower power consumption
- LCC package, convenient for welding
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: -20 °C to +80 °C
