FCS960K-N is a high-performance Wi-Fi 6 and Bluetooth 5.4 LCC package module launched by Quectel, which can be used for WLAN and Bluetooth connections. The module complies with IEEE 802.11a/b/g/n/ac/ax protocol, supporting up to 11ax MCS 11 rate at 40 MHz channel, and the transmission rate can reach 286.8 Mbps. FCS960K-N adopts reliable SDIO 3.0 interface, and provides 2.4 GHz and 5 GHz power amplifiers and low noise amplifiers.
With an ultra-compact size of 12.0 mm × 12.0 mm × 2.0 mm, FCS960K-N optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes FCS960K-N an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that FCS960K-N can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, FCS960K-N can meet various needs of commercial and industrial applications.
Key features
- 2.4GHz/5GHz Wi-Fi band and Bluetooth 5.4
- Wi-Fi/Bluetooth antenna 1 × 1
- SDIO 3.0 interface that supports higher data transmission rate and enables lower power consumption
- LCC package, convenient for welding
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: -20 °C to +80 °C
