FCM740D is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor with a frequency of up to 120MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256 KB SRAM, 2MB or 4MB flash, ensuring efficient performance. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards. FCM740D has an LCC + DIP form factor with an ultra-compact size of 20.3mm × 15.8mm × 2.7mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The module supports UART and GPIO interfaces by default. In the case of multiplexing, it can support PWM, SPI, I2C
and ADC. With a variety of low-power modes and keep-alive mechanism, it can provide flexibility and versatility for a range of applications, especially in smart homes, industrial IoT, consumer electronics and other application scenarios to meet various product needs. It is especially suitable for small-sized, high-temperature IoT devices, such as light bulbs, light strips, smart sockets.
FCM740D supports the QuecOpen® solution and standard AT commands, has a compact protocol stack, which can realize efficient product development for customers.
Key features
- Wi-Fi 4 module, single band (2.4GHz) Wi-Fi, 1 × 1 antenna
- PCB antenna or 1st RF coaxial connector
- BLE 5.2 and Wi-Fi pairing via Bluetooth
- Large memory, 256KB SRAM and 4MB flash
- Wide operating temperature range: -40°C to +105°C
- High stability, high reliability and full compatibility
