Quectel FC30R is a cost-effective, industrial grade Wi-Fi module featuring high performance and small size. With an ultra-compact size of 12.0 mm × 12.0 mm × 2.1 mm, it optimizes the size and cost for end-products, which fully meets the demands of size sensitive applications.
Surface-mount technology (SMT) makes FC30R an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that FC30R can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing which has strict requirements on cost and efficiency.
Combining advantages such as compact form factor, low power consumption, extended temperature range and stable SDIO interface, FC30R is typically used in combination with Quectel EC21 series, EC25 series, EC20 R2.1, EG25-G and EC200T series modules and other application processors (IMX6, IMX8, etc.) to serve a wide range of M2M applications, such as security, industrial PDA, MiFi, and health care.
Key Benefits
- Ultra-compact and cost-effective Wi-Fi module
- Supports IEEE 802.11 b/g/n standards
- Easier soldering and testing process with LCC package
- Stable and reliable SDIO communication interface
- Faster time to market: simple design minimizes design-in time and development efforts
