FG50V is an industrial-grade, high-performance Wi-Fi 6 and BLE (Bluetooth 5.2) module in the LGA package. It can be used to establish WLAN and Bluetooth connections. Supporting 2 × 2+ 2 × 2 MIMO, it provides a maximum data rate of up to 1774.5 Mbps. With a compact and unified form factor of 19.5 mm × 21.5 mm × 2.1 mm, FG50V is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design costs. It can be used with Quectel’s 5G RG5xQ series modules to formulate reliable 5G+Wi-Fi/Bluetooth applications.
The surface-mount technology enhances its durability and robustness, and the LGA package ensures that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated manufacturing that has strict requirements on cost and efficiency.
Designed with a reliable PCIe 2.0 interface to provide WLAN capability, FG50V achieves low-power and high-speed data transmission. This, coupled with its compact size and wide operating temperature range, enables the module to meet Wi-Fi/Bluetooth application design requirements in industrial, consumer, and MiFi fields.
Key Benefits
- Must work with Quectel 5G RG50xQ series modules and enjoy good co-existence mechanism with them
- 2 × 2 + 2 × 2 device supporting 802.11 a/b/g/n/ac/ax and 2.4/ 5 GHz dual-band, with max. data rate up to 1774.5 Mbps
- Operates in soft-AP and station mode, supports Bluetooth 5.2
- Operating temperature range: -30 to +85 ℃
- Excellent EMC/ESD protection ensures great robustness even in harsh environments
- Compact SMT form factor ideal for integration in slim and size-constrained solutions
