MeiG-SRM6690 5G Smart Module - SATRON electronics
MeiG Smart SRM6690
Next-generation 5G-Advanced communication module
  • 5G NR sub-6 GHz, DL 4×4 MIMO (SA/NSA), UL 2×2 MIMO (SA)
  • Wi-Fi 7 with 2×2 MU-MIMO
  • Configurable AI performance:
    FP1 – 2 TOPS / FP2 – 3.5 TOPS / FP3 – 4.5 TOPS / FP4 – 6 TOPS
  • Dual independent displays (WFHD+ @144 Hz + 4K60 Hz via DisplayPort)
  • 4 camera interfaces
  • Integrated dual-band GNSS (L1 + L5)
  • 4K@60 fps recording / 4K@120 fps playback
  • Rich I/O: USB, PCIe, SPI, UART, and more

The MeiG Smart SRM6690 series core board is built on the Qualcomm Kryo™ CPU (Cortex-A715 FP4), featuring a tri-cluster architecture: 1× Kryo Prime up to 2.9 GHz, 3× Kryo Gold up to 2.7 GHz, and 4× Kryo Silver up to 2.0 GHz. It is fabricated on a 4 nm FinFET process and incorporates 64-bit ARM V9 cores. The integrated Adreno™ GPU 7-series supports OpenGL ES 3.2, Vulkan 1.x, OpenCL 2.0, and DirectX 12 FL12. For AI acceleration, the module includes an AI processor with dual HVX and 4K HMX, offering configurable AI performance levels. The Adreno™ VPU 7-series enables up to 4K@60 video encoding and 4K@120 video decoding, with support for H.264, HEVC, and VP9.

The module runs Android 15 and comes with 64 GB storage and 4 GB RAM. It supports 5G NR sub-6 GHz with DL 4×4 MIMO and UL 2×2 MIMO, both NSA and SA modes, integrated L1+L5 GPS, and dual-band 2×2 MIMO Wi-Fi 7 with Bluetooth 6.0.

Pin-to-pin compatible with the MeiG SRM955, the SRM6690 enables flexible upgrading and migration. A rich set of interfaces is provided, including LCM, touch panel, camera, microphone, speaker, UART, USB, I2C, SPI, PCIe, and more. It supports voice, SMS, and phonebook functions. Target applications span 5G video recorders, smart POS terminals, logistics devices, VR cameras, intelligent robots, video surveillance, security monitoring, smart data-capture equipment, smart handheld terminals, drones, and a wide range of other 5G-connected embedded solutions.

Basic Attributes:
Product number: 5G Smart Module SRM6690
Package: LGA
Size(mm): 56.0mm × 53.0mm × 2.95mm
Certifications: FCC*/ CE*/ IC*/ RCM*/ UKCA*/ PTCRB*/ GCF*(US SKU)
Band Information:
US 5G-FDD: n2/ n5/ n7/ n12/ n13/ n14/ n25/ n29/ n30/ n66/ n71;
5G-TDD: n38/ n41/ n48/ n77/ n78;
5G 2*2MIMO(UL): n38/ n41/ n48/ n77/ n78;
5G 4*4MIMO(DL): n2/ n7/ n25/ n30/ n66/ n38/ n41/ n48/ n77/ n78;
4G-FDD:
B2/ B4/ B5/ B7/ B12/ B13/ B14/ B17/ B25/ B26/ B29/ B30/ B66/ B71;
4G-TDD: B38/ B41/ B48;
4G 4*4 MIMO(DL): B2/ B4/ B7/ B25/ B30/ B38/ B41/ B48/ B66
4G 2*2 MIMO(DL): B5/ B12/ B13/ B14/ B17/ B29/ B71
WCDMA: B2/ B4/ B5;
GSM: B2/ B5/ B8;
EMEA: 5G-FDD: n1/ n2/ n3/ n5/ n7/ n8/ n20/ n28;
5G-TDD: n38/ n40/ n41/ n77/ n78/ n79;
5G 2*2MIMO(UL): n77/ n78/ n79;
5G 4*4MIMO(DL): n1/ n3/ n7/ n38/ n40/ n41/ n77/ n78/ n79;
4G-FDD: B1/ B2/ B3/ B4/ B5/ B7/ B8/ B20/ B26/ B28;
4G-TDD: B38/ B39/ B40/ B41/ B42/ B43;
4G 4*4MIMO(DL): B1/ B3/ B7/ B38/ B40/ B41/ B42/ B43;
4G 2*2MIMO(DL): B2/ B5/ B8/ B20/ B26/ B28/ B39/ B40
WCDMA: B1/ B2/ B5/ B8;
GSM: B2/ B3/ B5/ B8;
Module Interfaces:
PCIe ×1  
I2C ×10  
(U)SIM ×2  
UART ×3  
SD ×1  
SPI ×2  
ADC ×2  
GPIO ×13  
Flashlight ×4  
LED ×4  
Temperature and Humidity:
Routine operating temperature: -40°C to 75°C

Remark: * under development