AF55C is an automotive grade Wi-Fi 6 and Bluetooth 5.2 module with high performance, supporting 2 × 2 MIMO. It is designed to be used together with Quectel automotive AG56xN family modules to establish WLAN and Bluetooth connections.
With a compact and unified form factor of 19.5 mm × 21.5 mm × 2.85 mm, AF55C is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design cost. The surface-mount technology enhances its durability and robustness, and the LGA package makes sure the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost and efficiency.
Designed with a reliable PCIe 2.0/SDIO interface to provide WLAN capability, AF55C achieves low-power and highspeed data transmission. Coupled with its compact size and wide temperature range, AF55C meets Wi-Fi/Bluetooth + LTE-A/5G application design requirements in automotive industry.
Key Benefits
- Automotive grade Wi-Fi & Bluetooth module supporting 2.4 GHz and 5 GHz Wi-Fi and Bluetooth 5.2
- Support 2 × 2 MIMO
- PCIe 2.0/SDIO interface which provides higher data transmission rate and lower power consumption
- Ideal for automotive market applications with IATF16949: 2016 requirement. Compliant with automotive quality processes such as APQP and PPAP.
- Wide operating temperature range meets the demanding requirements for automotive devices
- Fast time-to-market: simple design minimizes design-in time and development efforts
