AF50T is an automotive grade Wi-Fi 6 and Bluetooth 5.2 module with high performance. It is designed to be used together with Quectel automotive modules AG52xR and AG55xQ to establish WLAN and Bluetooth connections, supporting 2 × 2 + 2 × 2 MU-MIMO. With a compact and unified form factor of 19.5 mm × 21.5 mm × 2.3 mm, AF50T is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications, and helps customers reduce product size and optimize application design cost. The surface-mount technology enhances its durability and robustness, and the LGA package makes sure the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost and efficiency.
Designed with a reliable PCIe 2.0 interface to provide WLAN capability, AF50T achieves low-power and high-speed data transmission. Coupled with its compact size and extended temperature range, AF50T enables the module to meet Wi-Fi/Bluetooth + LTE-A/5G application design requirements in automotive industry.
Key Benefits
- Qualcomm QCA6696 chipset solution dedicated for automotive applications
- Work with Quectel AG55xQ/AG52xR series modules
- Support 802.11 a/b/g/n/ac/ax Wi-Fi and Dual-Band Simultaneous (DBS) with dual-MAC
- Operate in soft-AP and station mode and support Bluetooth 5.2
- Ideal for automotive applications with IATF 16949 requirement
- Automotive quality processes (PPAP, 8D, DFMEA, PFMEA…)
- Operating temperature range: -40 to +85 ℃
- Excellent EMC/ESD protection ensures great robustness even in harsh environments
- Compact SMT form factor ideal for integration in slim and size-constrained automotive solutions
