Quectel AF20 is a cost-effective Wi-Fi 5 and Bluetooth 5.0 module with high performance. The ultra-compact 17.2 mm × 15.2 mm × 2.26 mm profile makes it a perfect choice for size sensitive applications. The compact and unified form factor can also help customers reduce product sizes and cut costs.
Surface-mount technology (SMT) makes AF20 an ideal solution for durable and rugged designs. The compact LGA package ensures AF20 can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost and efficiency.
Combining advantages such as compact form factor, low power consumption, wide temperature range and stable SDIO interface, AF20 is especially applied to automotive industry applications.
Key Benefits
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Ultra-compact Wi-Fi & Bluetooth module
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Support Bluetooth 5.0 technology
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Support IEEE802.11a/b/g/n/ac standards
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Easier soldering and testing process with LGA package
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Stable and reliable SDIO 3.0 communication interface
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Fast time-to-market: simple design minimizes design-in time and development efforts
