Name: satronel.com
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Quectel Automotive Modules

Quectel AG215S

C-V2X Automotive Grade Module

Automotive grade application processor module
33.0mm × 33.5mm × 3.30mm
7.07g
LGA form factor
SMT package
Extended temperature range of -40°C to +85°C

The AG215S is an automotive grade application processor module for C-V2X and telematics applications in an LGA form factor which measures 33.0mm × 33.5mm × 3.30mm and weighs 7.07g. Featuring a 1.4 GHz dual-core processor (and optional quad-core processor) with 64-bit ARM Cortex-A53 microprocessor cores and dedicated AP for ITS stack and applications, the AG215S is optimized for performance with Quectel’s automotive modules AG15, AG520R, and AG550Q.

The module’s extended temperature range of -40°C to +85°C ensures performance in harsh environments. The AG215S has scalable ECDSA capability of up to 2500TPS through embedded engine and CPU (based on NIST p-256 and SM2), and a wide range of interfaces (including SDIO, PCIe Gen2, USB 3.0 and USB 2.0, UART, SPI, I2C, 1PPS input, ADC, and RGMII up to 1Gbps).

Key features

1.4GHz dual-core processor (quad-core optional)
64-bit ARM Cortex-A53 microprocessor cores
Scalable ECDSA capability of up to 2500TPS through embedded engine and CPU
Supports SDIO, PCIe Gen2, USB 3.0*1 and USB 2.0*1, UART, SPI, I2C, 1PPS input, ADC, and RGMII up to 1Gbps
Embedded hardware crypto engine to fulfil ECDSA verification
Additional HSM/SE integrated

C-V2X EAP Module	AG215S-CN	AG215S-GL	AG215S-GLR
Region/Operator	Global	Global	Global
Dimensions (mm)	33.5 × 34.2 × 3.25	33.5 × 33.0 × 3.25	33.5 × 33.0 × 3.25
Temperature Range
Operating Temperature	-35 °C to +75 °C	-35 °C to +75 °C	-35 °C to +75 °C
Extended Temperature	-40 °C to +85 °C	-40 °C to +85 °C	-40 °C to +85 °C
HSM Integrated
HSM Integrated	High performance HSM: TTM2000 Cost-efficient HSM: XDSM3275	Cost-efficient HSM: SLS37 No internal HSM	Cost-efficient HSM: XDSM3275
Interfaces
SDIO	× 1	× 1	× 2
USB	× 2 USB host interface: USB 3.0 and 2.0 compliant USB debug interface: USB 2.0 compliant	× 2 USB host interface: USB 3.0 and 2.0 compliant USB debug interface: USB 2.0 compliant	× 2 USB host interface: USB 3.0 and 2.0 compliant USB debug interface: USB 2.0 compliant
PCIe Gen 2	× 1	× 1	× 1
RGMII	× 1 (1 Gbps)	× 1 (1 Gbps)	× 1 (1 Gbps)
UART	× 2 (Main UART, Debug UART)	× 2 (Main UART, Debug UART)	× 2 (Main UART, Debug UART)
SPI	× 2	× 2	× 3①
I2C	× 2	× 2	× 2
1PPS	× 1 (Input)	× 1 (Input)	× 1 (Input)
ADC	× 2	× 2	× 2
Enhanced Features
High Security	Secure Boot SELinux	Secure Boot SELinux	Secure Boot SELinux
Total Memory	4 Gb + 4 Gb MCP	4 Gb + 4 Gb MCP	4 Gb/ 8 Gb/ 16 Gb RAM only
CPU MIPS	6.4/ 12.8K DMIPS (Optional)	6.4/ 12.8K DMIPS (Optional)	6.4/ 12.8K DMIPS (Optional)
Aerolink	Optional	Optional	Optional
Powerful ECDSA Capability	Curve Supported: NIST p-384, NIST p-256 Brainpool p-384, Brainpool p-256 SM2 256 bit	Curve Supported: NIST p-384, NIST p-256 Brainpool p-384, Brainpool p-256 SM2 256 bit Encryption algorithm varies with the integrated HSM specification	Curve Supported: NIST p-384, NIST p-256 Brainpool p-384, Brainpool p-256 SM2 256 bit
Scalable ECDSA Capability	Up to 2500 TPS through Embedded Hardware Engine and CPU (Based on NIST p-256 and SM2) Hardware Crypto Engine Embedded Support Secret Key Generation and Storage, and Digital Signature and Verification Additional 2000 TPS ECSDA Capability Supported (Based on NIST p-256 and SMT)	Up to 2500 TPS through Embedded Hardware Engine and CPU (Based on NIST p-256 and SM2) Hardware Crypto Engine Embedded Support Secret Key Generation and Storage, and Digital Signature and Verification Additional 2000 TPS ECSDA Capability Supported (Based on NIST p-256 and SMT)	Up to 2500 TPS through Embedded Hardware Engine and CPU (Based on NIST p-256 and SM2) Hardware Crypto Engine Embedded Support Secret Key Generation and Storage, and Digital Signature and Verification Additional 2000 TPS ECSDA Capability Supported (Based on NIST p-256 and SMT)
ESD/ EMI Protection	Realized through Internal Specific Circuits and Components	Realized through Internal Specific Circuits and Components	Realized through internal specific circuits and components
Software Features
Linux Kernel	4.9.11/ 4.9.88/ 4.14	4.9.11/ 4.9.88/ 4.14	4.9.11/ 4.9.88/ 4.14
Protocol	QMI (Qualcomm MSM Interface)	QMI (Qualcomm MSM Interface)	QMI (Qualcomm MSM Interface)
Electrical Characteristics
Supply Voltage	VBAT: 3.5–4.3 V, typ. 3.8 V VCC_1V8_IN: 1.7–1.9 V, typ. 1.8 V	VBAT: 3.5–4.3 V, typ. 3.8 V VCC_1V8_IN: 1.7–1.9 V, typ. 1.8 V	VBAT: 3.5–4.3 V, typ. 3.8 V VCC_1V8_IN: 1.7–1.9 V, typ. 1.8 V
Power Consumption	Varies with customer’s applications	Varies with customer’s applications	Varies with customer’s applications

NOTE:
①: Two SPI interfaces are used for external applications, with the third one for the integrated HSM, which is available for connecting an external HSM if the integrated HSM is not needed.

- Quectel_AG215S_Automotive_Module_Specification_V1.2
  
  pdf (237.08 KB)