M66-DS is an ultra-small Dual SIM Dual Standby quad-band GSM/GRPS module using LCC castellation package. Based on the latest 2G chipset, it has the optimal performance in SMS & data transmission and audio service even in harsh en-vironment. The Dual SIM Dual Standby function allows cus-tomers to use two SIM cards in one device simultaneously. The ultra-compact 15.8 × 17.7 × 2.3mm profile makes M66-DS a perfect platform for size sensitive applications.
M66-DS adopts surface mount technology, making it an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensures M66-DS can be easily em-bedded into low-volume applications and provide reliable con-nectivity for the applications. This kind of package is ideally suited for large-scale manufacturing which has strict require-ments for cost and efficiency.
The compact form factor, low power consumption and two SIM card interfaces make M66-DS the best choice for applications such as wearable device, automotive, industrial PDA, personal tracking, wireless POS, smart metering, telematics and other M2M applications.
Key features
- Ultra compact form factor with Dual SIM Dual Standby (DSDS) feature
- Easier soldering process with LCC package
- Power consumption as low as 1.3mA
- Support Voice, Bluetooth, QuecFOTA™
- Embedded powerful Internet service protocols, multiple Sockets & IP addresses
