Specification
|
| Soc |
RK3399K (28 nm HKMG lithography process ) , max frequency 2.0 GHz
|
| CPU |
ARM® 6-core 64-bit processor (Dual-core Cortex-A72(big)+ Quad-core Cortex-A53) based on big. LITTLE architecture
|
| GPU |
ARM® Mali-T860 MP4 quad-core GPU, support AFBC ( Frame Buffer Compress)
Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11
Built-in high-performance 2D acceleration hardware
|
| VPU |
Support 4K 10bits VP9/H265/H264 video decoding, up to 60fps
1080P multi-format video decoding (vc-1, mpeg-1/2/4, VP8)
1080P video encoding, which supports h.264, VP8 format
Video post-processing: IVTC, denoising, edge/detail/color optimization
|
| PMU |
RK808 Power management unit |
| RAM |
2GB dual-channel 64bit DDR3-1333MHz (1GB/2GB/4GB optional ) |
| Storage |
16GB high-speed eMMC 5.1 (8GB/16GB/32GB/128GB optional )
|
| OS |
Android , Linux, Flint OS
|
Hardware Features
|
| Wireless |
With SDIO port, to extend WiFi&Bluetooth two-in-one module, supports 2.4GHz / 5GHz dual-band WiFi, 802.11a/b/g/n/ac protocol
|
| Ethernet |
Integrated GMAC Ethernet controller, supports Realtek RTL8211E expansion to reach 10/100/1000Mbps
|
| Display |
Video output ports:
- 1 x HDMI 2.0 , Supports 4K@60HZ output and HDCP 1.4/2.2
- 1 x DP 1.2 (DisplayPort) , Supports 4K@60fps output
Display ports (Supports dual monitors with same or different displaying) :
- 1 x MIPI-DSI , Supports dual-channel 2560x1600@60fps output
- 1 x eDP 1.3 ( 4 lanes with 10.8Gbps )
|
| Audio |
1 x HDMI 2.0 and 1 x DP 1.2 ( DisplayPort ) , audio output
1 x SPDIF digital audio port, for audio output
3 x I2Sfor audio input and output, (I2S0/I2S2 supports 8-channel input/output, I2S2 internally supports HDMI/DP audio output)
|
| Camera |
2 x MIPI-CSI camera port( built-in dual ISP, supports up to single 13Mpixel or dual 8Mpixel)
1 x DVP camera port (Supports up to 5Mpixel)
|
| USB |
2 x USB2.0 Host, 2 x USB3.0 |
| Other |
I2C, I2S, SPI, UART, ADC, PWM, GPIO, USB, PCIe, SDMMC
|
| Environment |
Operating Temperature: -20℃-70℃,
Storage Temperature: -20℃-85℃,
|
Appearance
|
| Size |
82mm x 63mm |
| Interface |
MXM3.0 (314 PIN, 0.5mm pitch) |
| PCB |
Design of 8-layer board and gold-immersion technique |
| Weight |
24g |
