Wi-Fi 802.11 a/b/g/n, BLE, ARM Cortex M4 MCU Module AcSiP AI7697HD

  • Wi-Fi 802.11 a/b/g/n, BLE, ARM Cortex M4 MCU Module AcSiP AI7697HD
Wi-Fi 802.11 a/b/g/n, BLE, ARM Cortex M4 MCU Module AcSiP AI7697HD
  • -40°C ~ +85°C
  • Size 18×18×1.7 mm

AI7697HD is a highly integrated SIP module which features an application processor, a low power 1x1 11n Dual-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. AI7697HD also includes embedded SRAM/ROM and an external 4MB serial flash.

Key Feature

    • Small footprint:18 x 18 x 1.7 mm
    • ARM Cortex M4 MCU with FPU with up to 192MHz clock speed
    • 352KB SRAM / 64KB boot / 4MB Flash
    • IEEE 802.11 a/b/g/n compliant
    • Bluetooth 4.2 Low Energy (LE)
    • Hardware crypto engines including AES, DES/3DES, SHA2 for network security
    • Security support for WFA WPA/WPA2 personal, WPS2.0, WAPI
    • Two UART interfaces with hardware flow control and one UART for debug, all multiplexed with GPIO
    • Two I2C master interface multiplexed with GPIO
    • One I2S interface multiplexed with GPIO
    • Security support for WFA WPA/WPA2 personal, WPS2.0, WAPI
    • Integrated LNA, PA, and T/R switch
    • Operation Temperature: Operating : -40℃ ~ +85℃
    • On module MHF4 series connector: 20449-001E

Feature

    • Main Chip: MT7697DN
    • ARM Cortex M4 MCU with FPU with up to 192MHz clock speed
    • Embedded 352KB SRAM and 64KB boot ROM
    • 4MB external serial flash
    • Supports 2.4G/5G Wi-Fi IEEE802.11a/b/g/n
    • Hardware crypto engines including:AES, DES/3DES, SHA2 for network security
    • Internal switch and control for RX diversity
    • Bluetooth 4.2 Low Energy (LE)
    • Small Size 18 X 18 X 1.7 mm
    • Versatile interface:
      • 28 GPIO/PWM multiplexed with other interfaces
      • Two UART interfaces with hardware flow control and one UART for debug, all multiplexed with GPIO
      • One SPI master/Slave interface multiplexed with GPIO
      • One I2S interface multiplexed with GPIO
      • Two I2C master interface multiplexed with GPIO
      • 4 channel 12-bit ADC multiplexed with GPIO
      • IrDA

Operation Conditions

Power Supplies: 3.3V (typ.)
I/O Voltage: 3.3V (typ.)
Dimension: 18 x 18 x 1.7 mm (typ.)
Package: Stamp type module with shielding case MHF4 connector on module
Temperature: Operating : -40℃ ~ +85℃
Storage : -40℃ ~ +105℃
Humidity: Operating : 10 ~ 95% (Non-Condensing)
Storage : 5 ~ 95% (Non-Condensing)