Product information
SN-M297
Push-push Micro-SIM card connector
-
General Characteristics
- Size (mm)15.75 x 17.17 x 1.50
- Weight0.4 ± 0.1g
- Durability1,500 cycles min.
Electrical Characteristics
- Contact resistance
- Date Contact150mΩ max
- CD Switch500mΩ max
- Insulation resistance>1000MΩ/500V DC
-
Solderability
- Vapor phase215℃, 30 sec. Max
- IR reflow250℃, 5 sec. Max
- Manual soldering370℃, 3 sec. Max
Environmental Characteristics
- Operating temperature-40℃~+85℃
- Operating humidity10%~95%RH
Adobe Reader 9 or newer version is required to view following below PDF files. This is a free program available from the Adobe web site. Follow the download directions on the Adobe web site to get your copy of Adobe Reader.
| SN-M297 datasheet.pdf | (1.7 MB) | ||
| SN-M297 drawing | (124.6 KB) | ||
| 3D Model (STEP) | (578.9 KB) |
Similar products
-
SN-M497
Micro-SIM Card Connector
Learn more >- Size: 17.20 × 16.50 × 1.35mm
- Weight: ~ 0.5g
- Working Temp: -40℃~+85℃
- Humidity: 10%~+95%RH
-
SN-M397
Micro-SIM Card Connector
Learn more >- Size: 14.10 × 13.30 × 1.50mm
- Weight: ~ 0.6g
- Working Temp: -40℃~+85℃
- Humidity: 10%~+95%RH
Latest news
-
30.05.2019
The new generation of Smart LTE Cat 6 modules
SC600T/SC600Y is Quectel’s new generation of multi-mode Smart LTE Cat 6 module with built-in Android 9.0 OS. Based on Qualcomm octa-core and 64-bit high-performance processors wi...
-
06.09.2018
Quectel announces the release of MC90
Quectel Wireless Solutions, the leading global supplier of Internet of Things (IoT) modules, today announces the release of MC90, a quad-band GSM/GPRS/GNSS/Wi-Fi module. The new ...
-
13.03.2018
Quectel Launches Automotive-grade AG35 Module (IATF 16949 Certification)
AG35 is a series of automotive grade LTE category 4 module developed by Quectel. Designed and manufactured according to IATF 16949:2016 quality management system, it is targeted ...